Capabilities - U.S. Facilities
U.S. Manufacturing Capabilities
- Quick-turn prototyping - Flexible turnaround time from 3 to 5 days from a complete material kit and complete documentation
- Dock-to-stock distribution
- Kanban manufacturing
- JIT manufacturing
- Automated high-volume assembly
- Statistical process control with real-time defect trend analysis and data collection
- SMT and through-hole assembly mixed components assemblies
- Conformal coating services, including urethane, 2-part epoxies, and paralyne finishes, silicon, and acrylic
- SMF single sided and double sided
- Mixed technologies
- Rigid, flex, and rigid-flex
- X-ray inspection
- AOI inspection
- Mechatronics Assembly
Process Capabilities
- No clean chemistry
- Water soluble chemistry
- RoHS-5 and RoHS-6 manufacturing
- RMA chemistry
- Ionic contamination testing
- Manufacturing for customers with high impedance requirements and ionic contamination requirements of less than 6.5 µg/square inch
- Wave soldering and selective soldering
- Multiple board finishes including HASL, nickel-gold, and immersion tin and silver
- Ball Grid Array (BGA) rework, re-balling and inspection services using x-ray
- Interconnection and packaging consulting
- Process development
SMT Assembly Capabilities
- Single-sided component populated boards
- Double-sided component populated boards
- Single-layer rugged/heavy construction
- Multi-layer complex and handling sensitive boards
- Flexible circuit assemblies
- Low-volume to high-volume manufacturing
- Fine-pitched QFPs and passives
- Plastic, tape, and ceramic ball grid arrays (BGAs)
- Chip scale packages
- Fine-pitched SMT connectors
- Assembly capabilities span 01005 passives, 0.3mm QFPs, 0.3mm CSPs at one end of the dimensional scale to 1,180 pin BGA
- High-density BGA
- High-density, complex SMT
- High pin count interconnect
- CGA/LGA assembly
- High I/O BGA
- Direct chip attach
- Chip scale attach
- PCMCIA
Through-hole Assembly Capabilities
- Component lead forming: automatic and semi-automatic forming equipment
- Axial component sequencing
- Semi-automatic insertion
- Manual/mechanical assembly: application of staking, nuts/bolts, and studs
Box Build Capabilities
- Full systems integration
- Sub assemblies and complete system assembly
- Power supplies
- Full product testing: digital, analog, RF, mixed technologies
- Configuration management
- Finished goods stocking programs
- End user order fulfillment capabilities
- Final system integration
Design for Manufacturability Capabilities
Quality Systems provides customers with plans to improve quality and reduce manufacturing costs through a Design for Manufacturability (DFM) Review, a system integrating all incoming logistical and engineering data into a single database for efficient pre-production and communication. Additional design services are listed below.
- Circuit design
- Board design from schematics
- Mechanical and product design
- Sourcing and procurement
- Prototype and volume board assembly
- Design and implementation of product testing
- Review and recommendations of design considerations
Testing
- ICT
- Flying Probe
- RF Assay, S/A and CCA Functional Testing
- Cable Testing
- Point to point
- X-Ray
- AOI
- Full systems testing
- RF testing