Capabilities - U.S. Facilities

 QSIC US Facilities

U.S. Manufacturing Capabilities

  • Quick-turn prototyping - Flexible turnaround time from 3 to 5 days from a complete material kit and complete documentation
  • Dock-to-stock distribution
  • Kanban manufacturing
  • JIT manufacturing
  • Automated high-volume assembly      
  • Statistical process control with real-time defect trend analysis and data collection
  • SMT and through-hole assembly mixed components assemblies
  • Conformal coating services, including urethane, 2-part epoxies, and paralyne finishes, silicon, and acrylic
  • SMF single sided and double sided
  • Mixed technologies
  • Rigid, flex, and rigid-flex
  • X-ray inspection
  • AOI inspection
  • Mechatronics Assembly

Process Capabilities

  • No clean chemistry
  • Water soluble chemistry
  • RoHS-5 and RoHS-6 manufacturing
  • RMA chemistry
  • Ionic contamination testing
  • Manufacturing for customers with high impedance requirements and ionic contamination requirements of less than 6.5 µg/square inch
  • Wave soldering and selective soldering 
  • Multiple board finishes including HASL, nickel-gold, and immersion tin and silver
  • Ball Grid Array (BGA) rework, re-balling and inspection services using x-ray
  • Interconnection and packaging consulting
  • Process development

SMT Assembly Capabilities

  • Single-sided component populated boards
  • Double-sided component populated boards
  • Single-layer rugged/heavy construction
  • Multi-layer complex and handling sensitive boards
  • Flexible circuit assemblies
  • Low-volume to high-volume manufacturing
  • Fine-pitched QFPs and passives
  • Plastic, tape, and ceramic ball grid arrays (BGAs)
  • Chip scale packages
  • Fine-pitched SMT connectors
  • Assembly capabilities span 01005 passives, 0.3mm QFPs, 0.3mm CSPs at one end of the dimensional scale to 1,180 pin BGA
  • High-density BGA
  • High-density, complex SMT
  • High pin count interconnect
  • CGA/LGA assembly
  • High I/O BGA
  • Direct chip attach
  • Chip scale attach

Through-hole Assembly Capabilities

  • Component lead forming: automatic and semi-automatic forming equipment
  • Axial component sequencing
  • Semi-automatic insertion
  • Manual/mechanical assembly: application of staking, nuts/bolts, and studs

Box Build Capabilities

  • Full systems integration
  • Sub assemblies and complete system assembly
  • Power supplies
  • Full product testing: digital, analog, RF, mixed technologies
  • Configuration management
  • Finished goods stocking programs
  • End user order fulfillment capabilities
  • Final system integration

Design for Manufacturability Capabilities
Quality Systems provides customers with plans to improve quality and reduce manufacturing costs through a Design for Manufacturability (DFM) Review, a system integrating all incoming logistical and engineering data into a single database for efficient pre-production and communication. Additional design services are listed below.

  • Circuit design
  • Board design from schematics
  • Mechanical and product design
  • Sourcing and procurement
  • Prototype and volume board assembly
  • Design and implementation of product testing
  • Review and recommendations of design considerations


  • ICT
  • Flying Probe
  • RF Assay, S/A and CCA Functional Testing
  • Cable Testing
  • Point to point
  • X-Ray
  • AOI
  • Full systems testing
  • RF testing